Outer
Diameter
ØA
Part Number
Material
Thickness
Body
Width
B
Height
C
Dimple
Depth
E
Dimple
Diameter
ØF
Flat
Top Dia.
ØT
Trip Force
Plating
Contact
Life
Cycle
PCB Layout
Suggestion
Single/Double
Side
Inquiry
8 mm
8-TDF-TOP-320
0.08
7.4
0.56 ±0.05
0.08 ±0.05
1.6
5.5
320g ±30
bare
TBA
9 mm
9-TDF-TOP-400
0.08
8.25
0.61 ±0.05
0.08 ±0.05
1.6
6.2
400g ±30
bare
TBA
9 mm
SG 9-TDF-TOP-450
0.08
8.25
0.66 ±0.05
0.1 ±0.05
1.6
6.2
450g ±30
gold on contact side
TBA
10 mm
10-TDF-TOP-400
0.1
9.25
0.59 ±0.05
0.08 ±0.05
1.6
7
400g ±30
bare
TBA
10 mm
SG 10-TDF-TOP-450
0.1
9.25
0.61 ±0.05
0.1 ±0.05
1.6
7
450g ±30
gold on contact side
TBA
12 mm
12-TDF-TOP-400
0.1
11
0.72 ±0.05
0.08 ±0.05
1.6
8
400g ±30
bare
TBA
12 mm
DN 12-TDF-TOP-400
0.1
11
0.75 ±0.05
0.08 ±0.05
1.6
8
400g ±30
nickel on both side
TBA
 
Contact configuration:
 SPST N.O
Switching/working voltage:
 0.1 to 50V DC
Switching capacity:
 1 Watt
Switching current:
 0.005 to 100mA DC
Contact Resistance:
<100 ohms
<1 ohm (with plating)
Contact bounce make:
 <0.3ms
Contact bounce break:
 <0.6ms
 Operation temperature rating:
-40 degrees C to +100 degrees C
Storage temperature rating:
 -55 degrees C to +100 degrees C

 

*The product information above may be updated. For up to date information, pls contact our Sales Dept.
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